On 08/29/2015 01:01 AM, Mark J. Blair wrote:
On Aug 28,
2015, at 19:46, Jon Elson <elson at pico-systems.com> wrote:
Then, the only problem is the temp variation across the size of the oven, which can be
I'm thinking that air circulation should be helpful to reduce hot
spots, whether I'm baking boards or media. I expect that I'll get a much better
understanding of how my layout affects things like tombstoning once I reflow my own
boards. I've designed many a board, but other than ones I've hand soldered myself
with irons, they've all been assembled out of sight and out of mind from me.
Tombstoning is actually quite rare when using good solder
paste. I've done thousands of boards, had a fair share of
head-in-pillow and plain solder failure, but maybe just 6
actual tombstones. Probably the slow temperature ramp with
the toaster oven helps avoid this.