29 Aug
2015
29 Aug
'15
8:01 a.m.
On Aug 28, 2015, at 19:46, Jon Elson <elson at
pico-systems.com> wrote:
Then, the only problem is the temp variation across the size of the oven, which can be
considerable.
I'm thinking that air circulation should be helpful to reduce hot spots, whether
I'm baking boards or media. I expect that I'll get a much better understanding of
how my layout affects things like tombstoning once I reflow my own boards. I've
designed many a board, but other than ones I've hand soldered myself with irons,
they've all been assembled out of sight and out of mind from me.
--
Mark J. Blair, NF6X <nf6x at nf6x.net>
http://www.nf6x.net/