On Oct 26, 2011, at 1:25 PM, Dave McGuire wrote:
Yes, that drives me nuts, though I suppose it's
unavoidable. Is it Maxim or DalSemi who sells ICs in a package called "Flip
Chip"?
"Flip chip" is actually a pretty accepted term for IC packaging these days
(referring to ICs which attach directly to their package substrate via bumps on the bottom
rather than wirebonds). I can see why it'd drive you crazy, though... DEC had theirs
before ICs were even a useful product!
- Dave