On 11/30/2014 12:27 AM, Chuck Guzis wrote:
There was also some sort of stapled-wire technology that
was automated. I don't recall the name of it.
There was something I think was called stitch bond. Wire
that looked very much like
wire-wrap wire, but probably had thinned insulation was
ultrasonically bonded to
flat posts on the board. I have some military-grade gear
with flat pack chips that
used this much like one would make wire-wrap cards. But,
they were very compact
and hardly thicker than a standard PC board.
Then, there was the system that came before wire-wrap. It
posts on card edge connectors, and I think the wire was
stranded. There was
a "gun" that had a roll of little tin-plated clips. You
stuck the wire into the
gun, and squeezed the handle. It drove a clip onto the pin,
wire through the insulation. I've forgotten the name of
this system, too.
This was used for connecting up standard logic boards into a
not for use at the chip level.