28 Aug
2015
28 Aug
'15
7:42 a.m.
On Thu, 27 Aug 2015, Lyle Bickley wrote:
The IBM 1620 at the CHM is a running computer. There
were two teams that
worked on the 1620 at the CHM. The first Team got it running.
Unfortunately, IBM used the wrong kind of solder on the core memory and
so the wires of the core memory literally "dissolved".
With all the different solder alloys I work with regularly, I have to
ask...what type of solder caused that sort of damage? Was it the alloy
itself, or did IBM use a flux which was too active and then failed to
clean away all the residue? If they used a rosin-based flux, was it due to
the specific activator used in the flux?