On Tue, 9 Oct 2012, Liam Proven wrote:
I'll let others comment before I say too much about this one.
The tin whiskers bit though... as much of a problem as they can be in some
HV and RF circuits (including oscillator circuits*), a much larger problem
that I've seen has been the use of those damned lead-free solder alloys
with BGA components, where the joints fail due to thermal induced stress
cracking (often due to the difference in the thermal expansion rates of
the BGA component and PC board itself). Of course, this is still nothing
compared to the capacitor plague problem...
*I picked up a second hand USB host card that had grown significant tin
whiskers at the terminals of the two feedback capacitors in one of the
oscillator circuits. I fixed this permanently by reflowing and then
replacing the lead free solder used for those two capacitors with good
quality tin/lead solder. The board still has another issue due to apparent
rough handling by the prior owner though, so it is still sitting in the
to-do project box. I have a number of these very boards in active use, but
the capacitors used in the oscillator circuit on that particular board
were different from my other boards, and so far this is the only one of
these I've seen that had grown tin whiskers.