21 Dec
2018
21 Dec
'18
2:40 p.m.
The original "Flip Chip" was a packaging
failure. It was literally a die bonded to a PCB
and never went into production.
I think it is mentioned in "Computer Engineering"
IBM perfected the techniques to do this later with the development of solder bumps and
IR reflow.
Are you talking about the little black rectangles, sort of SIP
packages, DEC tried in the late 1960s? They were a disaster with
reliability, but they did ship.
--
Will