On Jul 15, 2009, at 1:56 PM, Roger Holmes wrote: I'd imagine that has more to do with the material in use than the fact that it's done in 3D. Not even close to being accurate enough for feature sizes that would be considered useful today. Keep in mind that ICs are *already* "3D" in that there are multiple layers, sometimes lots of them. -Dave -- Dave McGuire Port Charlotte, FL

On Wed, Jul 15, 2009 at 1:56 PM, Roger Holmes<roger.holmes at microspot.co.uk> wrote: That may be specific to the liquid-resin-UV-laser-cured parts (one of several 3D prototyping techniques). RepRap uses extruded molten ABS or other thermoplastic (there are several to choose from with compatible melting points). Unless your base plastic is UV sensitive, there shouldn't be a problem. There's nothing that the 3D printing process adds except bumps and internal layering and such from the process. Accurate computer control aside, melting points are a problem. Just like with building lost wax casting masters, you have to build your parts in order from highest melting point to lowest, or you'll demolish your model as you build it. Silicon has to get pretty hot before it flows. RepRap has successfully printed a simple component of itself - ABS resin base with solder "wires" and real (premade) LEDs and resistors for an end-stop sensor. It's a bit crude, but the melting point of solder combined with the latent heat capacity of a small extrusion did not result in badly deforming or melting the ABS base it was placed on. If 3D printing starts to incorporate circuitry, plastic components like OLEDs and conductive plastic "wires" seem to be more likely to me than adapting molten metal technologies to a thermal extrusion head. -ethan

On 15 Jul 2009 at 18:56, Roger Holmes wrote: What the heck, why not create a 1,000 piece order for new toggles machined from stainless steel in China? It might actually be cheaper, who knows? --Chuck (just kidding)