ckaiser(a)oa.ptloma.edu hath spoke: < Good think you didn't run it through the dry cycle, or chips like the PL < might short out (very sensitive to heat). The dry cycle is ok if the temperature is under 180f, too hot and it can over heat parts. I prefer the oven at 160-180f as it's drier and a bit faster. A blast of compressed air is also good for getting water out from under parts to hasten drying. The PALS while temperature sensitive and no more so than any of the LSI on the board. < Are you sure the soap wouldn't have hurt the solder or board traces, < though? Your kidding? Soap will not hurt the solder or the boards. How do you think assembled boards are cleaned commercially? Allison