From: Ethan Dicks: Tuesday, April 17, 2012 7:35 PM
On Tue, Apr 17, 2012 at 9:56 PM, David Griffith
<dgriffi at cs.csubak.edu> wrote:
Who was the one with the wacky idea of building a Straight-Eight PDP8 using
flipchip cards populated with surface-mount parts? I have a hankering to
run some numbers about it.
I remember discussing the topic with Vince Slyngstad. I just had wild
ideas - he had practical ideas.
I remember talking about it, but I'd have to look at my archives to recover
what was said.
I do have a drawing of an R202 on a 1"x2" board, with a 20-pin right angle
header instead of the 18-pin edge connector. I had also done a drawing for
an adapter, which would allow you to debug by replacing individual modules
in a real -8 or -8/S with their SMT equivalents.
It looks like at some point I started an SMT R210 drawing, but I must have
gotten distracted, as it never got done.
There were two approaches discussed - miniaturized SMT
Flip Chips
mounted on some sort of backplane interconnect, or one or two boards
large enough to contain the circuit of a Straight-8 but without the
modularity. The costs of thousands of pins put a damper on the
practical implementation of the first kind, and the cost of hundreds
of square inches of small-run PCBs put a damper on the second
approach.
Yep. I lean toward doing the interconnect because of the "cool factor"
of all the tiny little boards looking a bit like a miniaturized version of
the original. I think it would be more expensive, but easier to debug.
Of course, you probably end up with a "big board" for the backplane,
but I can actually generate that auto-magically from drawings of a
full-size backplane. Still, one would have to pay to get it manufactured
and then to populate all the connector sites. Plus having all the module
boards fabricated.
One thing I am pretty sure of, is that you don't want gold edge connectors.
Those are just way too pricey, and they tend to also move you out of the
places that will let you send them a panelization. (Instead, I suggest the
use of gold-plated right-angle headers to connect to the backplane.)
Come to think of it, I do remember something about trying once upon a
time to figure out how many 8"x10" panel layouts would have to be sent
out to end up with all the right module quantities. I think that might have
been for an 8/S design, though.
Vince would probably be the one who ran numbers.
As I say, I'd have to look in my archives.
I still think it's a neat idea, but likely to be
too expensive to
undertake casually.
Got a front panel? Those are the really expensive part, I believe.
I suspect one would spend about as much getting a nice front
panel made as for the CPU guts. (Assuming standard 2-sided
"prototype quality" service for the boards, and quantity purchases
of a few types of SMT transistors, diodes, and such.)
Oh, and another issue -- unless you redo all the component values,
you'll end up generating the same heat in a much smaller volume.
I'm not enough of an expert to understand the tradeoff of power
against speed, but I doubt if one can get the speed without the
heat. At some point you'd also want to drive the bus cables, and
that will definitely need some power.
OTOH, replacing the core memory subsystem will probably save a
bunch of power.
Vince