26 Oct
2005
26 Oct
'05
12:50 p.m.
Brent wrote:
Across the history of ICs, DIP packaging begins to
look like a
25-to-30-year sidebar.
I like the way "flip chip" (not just the term, but the concept) is coming
back into vogue, forty years after DEC registered it as a trademark.
Tim.
26 Oct
26 Oct
1:22 p.m.
New subject: Flip Chips was Re: US Sources for old ICs
On Wed, 26 Oct 2005 15:50:45 -0400, Tim Shoppa wrote:
Brent wrote:
> Across the history of ICs, DIP packaging begins to look like a
> 25-to-30-year sidebar.
I like the way "flip chip" (not just the
term, but the concept) is coming
back into vogue, forty years after DEC registered it as a trademark.
Tim.
From: http://tarr.uspto.gov/servlet/tarr?regser=serial&entry=72200706
U.S. Class: 026 (International Class 009)
ELECTRONIC CIRCUIT MODULES OF THE PLUGABLE TYPE, CONTAINING ELECTRONIC COMPONENTS MOUNTED
ON CIRCUIT BOARDS AND CONNECTED TO CONDUCTORS
FORMED THEREON, AT LEAST ALL BUT ONE OF THE CONNECTIONS BETWEEN THE COMPONENTS AND
CONDUCTORS BEING ON SURFACES OTHER THAN SURFACES OF
SAID COMPONENTS CONTACTING THE BOARDS
First Use Date: 1964-08-24
Abandoned: 1987-03-06
Is this an early description of what we know today as surface mount ?
or an early description of the Controlled Collapse Chip Connection,
or C4 (C4) process used by Monolithic Systems Technology MST,
introduced in 1968 formally by IBM ?
Some pictures of the inside of a MST chip can be found here.
http://www.ibm-collectables.com/gallery/view_album.php?set_albumName=album86
Sure looks like a modern flip-chip just way bigger in those days.
Good ideas can manifests themselves in many ways and applications.
Bob Bradlee
27 Oct
27 Oct
6:51 a.m.
New subject: Flip Chips was Re: US Sources for old ICs
>>>> "Bob" == Bob Bradlee <Bob
at BRADLEE.ORG> writes:
Bob> On Wed, 26 Oct 2005 15:50:45 -0400, Tim Shoppa wrote:
> Brent wrote:
>> Across the history of ICs, DIP packaging begins to look like a
>> 25-to-30-year sidebar.
> I like the way "flip chip" (not just the
term, but the concept) is
> coming back into vogue, forty years after DEC registered it as a
> trademark.
> Tim.
Bob> From:
Bob> http://tarr.uspto.gov/servlet/tarr?regser=serial&entry=72200706
Bob> U.S. Class: 026 (International Class 009) ELECTRONIC CIRCUIT
Bob> MODULES OF THE PLUGABLE TYPE, ...
Bob> Is this an early description of what we know today as surface
Bob> mount ? or an early description of the Controlled Collapse Chip
Bob> Connection, or C4 (C4) process used by Monolithic Systems
Bob> Technology MST, introduced in 1968 formally by IBM ?
Certainly not surface mount. I don't know the other things you
mention, but probably not.
"Flip Chip" as a DEC trademark simply designates the PC board with
stuff on them that implements some function and can be plugged into a
backplane. Remember that DEC originally was in the logic modules
business -- the PDP-1 was its *second* product.
paul
6996
days inactive
6997
days old
2 comments
3 participants
participants (3)
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Bob＠BRADLEE.ORG -
pkoning＠equallogic.com -
tshoppa＠wmata.com