21 Dec
2015
21 Dec
'15
8:48 a.m.
From: Eric Smith
So far I have dumped the following LSI-11 Microms:
3010D, DEC P/N 23-001B5 (also designated CP1631-10) - addr 0x000-0x1ff
3007D, DEC P/N 23-002B5 (also designated CP1631-07) - addr 0x200-0x3ff
Excellent work!
I was going to point out that there is another uROM (KEV11) for the LSI-11,
for the EIS/FIS, and also that there is some variation in the numbers of
the uROM chips, but along the way, I ran into a puzzle.
DEC documentation differs on the location of the two uROM's in the LSI-11/2
(KD11-HA, M7270): the 'Microcomputer Products Handbook' gives the order (from
the handle end) as KEV11, uROM 1, uROM 0, Control, Data Path; the print set
for the KD11-HA gives KEV11, Control, uROM 1, uROM 0, Data Path!
From which I conclude that either: i) one of the
documents, perhaps the
Handbook, is wrong, or ii) the 'Control' chip must
also be a uROM, and that
there is some variation in how the 3 chips can be plugged in?
Here is more data from a couple of boards I have access to (from the handle
end):
- 2007C 23-002C4, 3010A 23-001B5, 3007D 23-002B5
- 2007C 23-002C4, 3010D 23-001B5, 3007D 23-007B5
- 2007C 23-003C4, 3010D 23-008B5, 3007D 23-007B5
Anyone know what's up here?
Getting back to the KEV11, the one I have seen is a 3015 23-003B5.
the control chip also contains PLAs that can force
microcode jumps under
various conditions despite there being no corresponding jump instruction in
the Microms.
Hmm. Any idea/way to read them out?
Noel
21 Dec
21 Dec
10:34 a.m.
On Mon, Dec 21, 2015 at 9:48 AM, Noel Chiappa <jnc at mercury.lcs.mit.edu> wrote:
I was going to point out that there is another uROM
(KEV11) for the LSI-11,
for the EIS/FIS, and also that there is some variation in the numbers of
the uROM chips, but along the way, I ran into a puzzle.
- 2007C 23-003C4, 3010D 23-008B5, 3007D 23-007B5
The 23-007B5 and 23-008B5 apparently are multiple Microm variants for
the base instruction set. GIven that the WD numbers are still 3007D and
3010D, I'd expect these to be only packaging or minor electrical variants,
but it would still be nice to read a set for verification.
There are also two part numbers for hybrid Microms, with two Microms
packaged on one DIP carrier, DEC P/N 23-002B6 or 23-003B6.
ii) the 'Control' chip must also be a uROM,
and that
there is some variation in how the 3 chips can be plugged in?
The control chip and data chip are not Microms, and MUST be plugged into
the correct socket.
The Microms all have the same pinout, and are wired completely in parallel,
so they can be interchanged.
In addition to the normal
Getting back to the KEV11, the one I have seen is a
3015 23-003B5.
There are a number of variants. That is a KEV11-A EIS/FIS, suitable for
the M7270 quad module etch revisions E and F, and the M7264 dual.
Another version of the KEV11-A EIS/FIS, suitable for the M7270 quad
module etch revisions C and D, is the 23-091A5. I don't know the WD
part number.
The KEV11-B provides EIS without FIS, suitable for the M7270 quad
module etch revisions C and D, 23-090A5. I don't know the WD part
number.
The KEV11-C provides a subset of the CIS commercial instruction set,
sometimes known as DIS (DIBOL instruction set), using two Microms,
which are 23-004B5 and 23-005B5. I don't know the WD part numbers.
I suspect there is probably also a hybrid (single DIP carrier) version of
the KEV11-C, but I don't know the part number.
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