12 Sep
2011
12 Sep
'11
12:55 p.m.
On Sun, 11 Sep 2011 17:49:50 +0100 (BST), ard at p850ug1.demon.co.uk (Tony
Duell) wrote:
I find that one needs to be very careful when prising, it is all too
easy to rip out the through-hole plating. It may not be a disaster but
sometimes it is very hard to solder the new IC on the component side.
/Jonas
I then put the
pliers down and lift the IC with my fingers.
If you can't lift the IC with your fingers you have not release all the
legs, don't try prying - this only leads to tears and swearing...
I find that
uyou can prise (pry) the IC looks after breaking the bond
between each pin and the CPB, but the trick is to know jsut how much
force you can safely apply without damaging either the IC (it is possible
to crack the DIL package and rip pins out) or the PCB. Prising can be
very useful to sdee which part of a large DIL pakacge seems ot be free
wnas whcih pios might still be holding it (and thus need resolderign and
desoldering again). Just take great care!
13 Sep
13 Sep
1:11 p.m.
I find that one needs to be very careful when prising,
it is all too
easy to rip out the through-hole plating. It may not be a disaster but
sometimes it is very hard to solder the new IC on the component side.
Or uyou'll damage the connection to a trace on an internal layer and not
know where it goes. Or you'll amke an intermittant fault.
Yes, you do have to be caful -- very careful -- if you try to prise the
IC out, but with experience you get to know how much force you can safely
apply. And not go beyond it.
-tony
4850
days inactive
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ard＠p850ug1.demon.co.uk -
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