I was perusing some topics on Wikipedia and came across this enlightening
tidbit of information in the article on "Gold plating":
"With direct gold-on-copper plating, the copper atoms tend to diffuse
through the gold layer, causing tarnishing of its surface and formation of
an oxide and/or sulfide layer.
"A layer of a suitable barrier metal, usually nickel, is usually deposited
on the copper substrate before the gold plating. The layer of nickel
provides mechanical backing for the gold layer, improving its wear
resistance. It also reduces the impact of pores present in the gold
layer."
http://en.wikipedia.org/wiki/Gold_plating
So this is why a re-seating of certain cards, connectors and ICs
oftentimes cures a fidgety system.
Just thought I'd share this. It was novel to me at least.
P.S. I'm assuming this information is accurate :)
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