E.U.N.U.C.H. (Cooling)

Sipke de Wal, I passed your concern about Beryllium Oxide to someone here. His response: The only danger is as mentioned below, dust which does not happen by accident. It is necessary to seriously grind or file the hard material to create dust. As long as you do not try to machine it or file it or break it up there is not problem. So, assemblers should be warned not to mistreat it, breaking grinding or filing it. When I use it I also use thermal compound to make a good thermal connection. This greasy substance also provides a measure of added protection because if the BEO were accidentally scratched or broken any small particles would become mixed into this greasy compound and not become airborne. It has the properties of: 1. a dielectric constant of about 6 for low capacitance 2. a very low thermal resistance for cooling If there is great fear of using it alumina can be substituted: 1. dielectric constant of 10 2. low thermal resistance but not as good as BEO. Ron Miller