On Saturday 10 May 2008 12:17, Chuck Guzis wrote:
Date: Fri, 9
May 2008 10:59:35 -0700 (PDT)
From: "Eric Smith"
The lead pitch of shrink DIP packages is 0.070 inch (1.78 mm). I
haven't seen any 0.050 (1.27 mm) inch DIPs. Shrink DIPs were popular
with Japanese semi companies, but never caught on very well with US
companies, most of which skipped those and went straight to PLCC and
PQFP packages.
Right you are--I dug out a couple of shrink DIPs and they are indeed
0.070 inch. Unless you're going right to PCB, these are a real pain
to deal with today--hard to find sockets, odd spacing, etc. I think
I've still got a couple of 64180s in this package kicking around
somewhere.
Thanks for the correction.
I haven't measured them but I do have about four or so HD6303Y (Hitachi CMOS
68xx variant with bunches of built-in peripheral stuff) that's in a package
like that. I managed to score *one* socket of the wire-wrap variety as a
sample at some trade show I was at years ago, but am not 100% sure that it's
standard 0.025" wrap posts, in which case I'm still screwed on being able to
do anything with them.
--
Member of the toughest, meanest, deadliest, most unrelenting -- and
ablest -- form of life in this section of space, ?a critter that can
be killed but can't be tamed. ?--Robert A. Heinlein, "The Puppet Masters"
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Information is more dangerous than cannon to a society ruled by lies. --James
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