21 Dec
2018
21 Dec
'18
8:02 p.m.
On 12/21/2018 10:51 AM, Al Kossow via cctalk wrote:
On 12/21/18 5:19 AM, Noel Chiappa via cctalk wrote:
The 360 was announced in 1964, first delivered in 1965,
using "flip chip" bonding of discrete transistors and diodes
on ceramic substrates, their "SLT" packaging. So, I'm not
too sure about the "later". The original PDP-8 was
introduced in 1965.
Jon
The DEC brochure for it (P5141) is a little
puzzling; it says (p. 2) that
"INTEGRATED CIRCUITS are basic elements of the low cost, newly designed
silicon FLIP CHIP modules used throughout PDP-7", but AFAIK, the first FLIP
CHIPs (R-series, B-series, etc) were all transistors; the later M-series were
the first ones to have ICs. Maybe this is some old meaning of "integrated
circuits"?
The original "Flip Chip" was a packaging failure. It was
literally a die bonded to a PCB
and never went into production.
I think it is mentioned in "Computer Engineering"
IBM perfected the techniques to do this later with the development of solder bumps and
IR reflow.