30 Mar
2002
30 Mar
'02
7:39 a.m.
> Is wire-wrap still a common prototyping
technique?
Another technique that I have found useful is tack soldering wire-wrap
wire to solder pads on pad per hole perfboard. The Kynar insulation is
heat resistant and does not shrink or burn. I usually install solder
tail sockets and then follow with point to point wiring. Multiple wires
per pad require some care in soldering (the wire has spring and tends to
pull away as the solder melts). Quite reliable and efficient for someone
skilled with a soldering iron.
For an example:
http://www.chd.dyndns.org/sbc/68k_back_half.jpg
The most dense area is about 3/4 inch thick.
-chuck
