Forgotten PC History

bfranchuk at jetnet.ab.ca wrote: MC10800 series. Quad-In-Line Package (QUIP): pins on two opposite sides of the body like a DIP, but with the lengths protruding from the package (before the downward bend) alternating between short and long, so that the pins are in two rows on each side. Rockwell was one of the biggest users of QUIP packages for microcontrollers and such. I'm not sure whether their QUIPs were dimensioned the same as the Motorola ones. Note that these are different than the QUIP package used by Intel for the iAPX-432 components, and by both Intel and Zilog for emulation bond-out chips, prior to the introduction of the JEDEC 68 position ceramic leadless chip carrier. This QUIP was designed by Intel and AMP, and was a leadless ceramic package with contacts along the two long sides, the contacts being staggered in a similar manner to the leaded QUIPs.