26 Oct
2010
26 Oct
'10
11:52 a.m.
On 26 Oct 2010 at 10:52, Eric Smith wrote:
Will wrote:
Well, maybe not from US manufacturers, but consider the NEC uPD768.
64-pin ceramic flatpack, 1978.
The quad flat package itself dates from at least the late 1960s.
See, for example, the Motorola XC177 in case 618, a 32-lead quad
ceramic package.
ISTR that the Japanese at the time were somewhat ahead of the US in
terms of high-density packaging. Didn't they originate the 64-pin
0.050" spaced DIP? I certainly recall seeing the fine-pitch DIP on a
lot of Japanese equipment.
I suspect that IBM and other mainframe manufacturers had some
proprietary high-density packaging at that time as well.
Bottom line is that in 1978 there were other alternatives to the 64-
pin 0.100" spaced giant DIP.
--Chuck
Why not use PGA or Flatpack?
Because
64-pin PGAs and flatpacks didn't exist in 1978. Even the
64-pin DIP was still fairly new.