25 Jul
2013
25 Jul
'13
4:19 p.m.
These are Solid Logic Technology packages. They were introduced by IBM in
the mid-1960s. The insides, as seen in the top of your image, are small
silicon dies (diodes and transistors alike) mounted upside-down on a
ceramic substrate. This was one of the first big advances in hybrid package
design, and a lot of the techniques used nowadays in hybrid packages
evolved from research at IBM regarding SLT.
As for what the actual devices are, your guess is as good as mine.
Kyle
On Thu, Jul 25, 2013 at 5:53 PM, Win Heagy <wheagy at gmail.com> wrote:
Any of you old timers (or otherwise) know what these
components were and
what they might have been used for? A keepsake from my wife's
grandfather's career with IBM. I'm guessing 1960s vintage, give or take.
http://imgur.com/PYJCrU0
Thanks,
Win