A good real terminal

On Thu, Apr 17, 2008 at 10:33:14PM +0100, Tony Duell wrote: For non-difficult vias, I typically apply heat and suction from the same side - less juggling. I am accustomed to good results with this technique (and can commonly recover intact parts from intact boards, if that's the goal, like the time I extracted an IM6120 from a DecMate III board - I wanted _both_ to survive so I could mount a socket and replace the CPU later). I find I only have to do the double-sided technique with tiny vias or vias that are tied to inner fill layers (Vcc and GND, typically). -ethan -- Ethan Dicks, A-333-S Current South Pole Weather at 17-Apr-2008 at 23:50 Z South Pole Station PSC 468 Box 400 Temp -76.5 F (-60.3 C) Windchill -110.5 F (-79.1 C) APO AP 96598 Wind 8.5 kts Grid 106 Barometer 680.2 mb (10621 ft) Ethan.Dicks at usap.gov http://penguincentral.com/penguincentral.html