24 Mar
2017
24 Mar
'17
12:56 p.m.
On 2017-Mar-24, at 11:06 AM, Paul Koning via cctalk wrote:
Which makes sense; DIP packages (independent of
material) are designed to a small set of standard dimensions. 0.1 inch lead pitch, pin
spacing 0.300 or 0.400 or 0.600 or similar round numbers.
One (perhaps the singular) exception to this is the DCJ11 (pdp11 microproc), a 60-pin DIP
with an over-wide body, ~ 1&9/32 in / 33mm, but then it's an unusual hybrid /
dual-chip ceramic package.