12 Jan
2014
12 Jan
'14
11:05 p.m.
On 1/12/14, 12:21 PM, Paul Koning wrote:
On Jan 12, 2014, at 12:48 PM, Philip Pemberton
<classiccmp at philpem.me.uk> wrote:
We're probably in a similar "place". When hand soldering a tssop or
tqfp sort of thing and it is going great, it is great. When it goes
bad, it is really bad, and sometimes I've ruined a board trying a repair.
I have since tried reflow, manually managing the temp (using a
thermocouple on the board, and having done some test runs to understand
the toaster oven) and it is more consistent. It seems a little
magical, which can be scary.
I haven't 100% switched over, but I think I will. I'd love to hear
that someone is having success with bga with toaster reflow.
Ryan
...
I do have a solder paste template for the board, working pick-and-place
system and convection reflow oven... they were purchased after the last
assembly house tried to screw me over (50% jump in NRE costs between
quoting and placing the order, followed by a demand that I sent an extra
ten spare FPGAs "just in case" which they were unwilling to return if
unneeded).
For those who can puzzle out German, here is a nice article about an
inexpensive reflow oven kit, and the writer?s experience putting it to work.
http://www.beta-estore.com/download/rk/RK-10001_76.pdf
I haven?t done BGA work, so up to now I?ve done my surface mount assembly with a
soldering iron, but I may change that next time; soldering 0.5 mm lead pitch TSSOP
packages by hand is not particularly comfortable.