Chuck wrote:
I wouldn't want to deal with the DIP as it's a
"skinny" DIP with
0.050 pin spacing,
The lead pitch of shrink DIP packages is 0.070 inch (1.78 mm). I haven't
seen any 0.050 (1.27 mm) inch DIPs. Shrink DIPs were popular with Japanese
semi companies, but never caught on very well with US companies, most of
which skipped those and went straight to PLCC and PQFP packages.
Motorola and Rockwell used QUIP packages for some parts. The leads
extend from the body on 0.050 inch (1.27 mm) pitch, but are formed into
two rows 0.100 inch (2.54 mm) apart.