4 Jun
2000
4 Jun
'00
3:52 p.m.
The solder wick method can work, but one is tempted to lift up on the pins
to pop the part loose, which will deform them forever. If you're better at
it than I am, you might succeed with that method. The gull-wing parts I've
used after using this extraction method have always been a source of
trouble, needing special care to solder them into a new application.
Dick
----- Original Message -----
From: Chuck McManis <cmcmanis(a)mcmanis.com>
To: <classiccmp(a)classiccmp.org>
Sent: Sunday, June 04, 2000 7:19 PM
Subject: Re: Removing surface-mounted ICs
You use solder wick. You lay it over the pins, you
wick up the solder that
is holding them down. Alternatively you use a suction grabber device and a
very small torch or hot air gun. (the latter is preferred). Attach the
pickup to the top of the chip, then blow the hot air gun on it, and lift
it
off.
--Chuck
At 12:58 AM 6/5/00 +0000, you wrote:
>Can anyone recommend a way of removing surface-mounted ICs (specifically
SOJ