jim s wrote:
Up to that time, INtel never had done a bondout chip
special for any
of their ice products, but used the same die with more signals for that
purpose.
I think you may be mistaken about that. Some of Intel's ICE products
for their single-chip micros used special bondout chips that brought out
signals not bonded out on the normal parts. These were for the 8048 and
8051 series parts. The early versions of the ICE for the 8048 did use
standard parts, and that caused problems where the ICE didn't behave
exactly the same as the masked-ROM part.
If I recall correctly, the special 8051 bond-out chip actually taped out
before the normal masked ROM and the EPROM version.
I suspect that there were special bondout chips for other related parts,
such as the 8021, 8041, etc., but I didn't use the corresponding ICE
products so I don't have any firsthand knowledge about those.
Eric