8 Apr
2010
8 Apr
'10
12:18 p.m.
From: Joachim Thiemann
A well-known trick (but worth repeatign nonetheless) is that once you
have removed the IC body, you clamp/hold the board vertically, apply the
soldering iron on the non-compoennt side of the board and the solder
sucker to the same hole on the compoennt side. Normally that will get the
holes totally clear.
I use that method to clean out holes if I want to add more components to
a wave-soldred board (e.g. for doing a RAM upgrade).
-tony
Bummer. I'm not good at desoldering chips
without potential damage
to the board. Joe.
The easiest way to not damage the board is to cut the leads to the chip,
and then use a solder sucker to remove the solder in the hole along with
the remnants of the chip leads. Hopefully if one or more of the leads is
soldered to the ground plane, those pads used thermal isolation to
separate them from the ground plane.