23 Jan
2012
23 Jan
'12
4:29 a.m.
On 22 Jan 2012 at 19:30, David Griffith wrote:
I can probably deal with QFPs, but BGAs are just
nasty, particularly
when combined with the wrong sort of solder.
My thought was that they'd be able to do the same trick, where each
contactl on the BGA would settle into its own solder-filled recess
and all you'd have to do is heat the area. But maybe not...
--Chuck