10 May
2008
10 May
'08
6:17 p.m.
Date: Fri, 9 May 2008 10:59:35 -0700 (PDT)
From: "Eric Smith"
The lead pitch of shrink DIP packages is 0.070 inch
(1.78 mm). I
haven't seen any 0.050 (1.27 mm) inch DIPs. Shrink DIPs were popular
with Japanese semi companies, but never caught on very well with US
companies, most of which skipped those and went straight to PLCC and
PQFP packages.
Right you are--I dug out a couple of shrink DIPs and they are indeed
0.070 inch. Unless you're going right to PCB, these are a real pain
to deal with today--hard to find sockets, odd spacing, etc. I think
I've still got a couple of 64180s in this package kicking around
somewhere.
Thanks for the correction.
Cheers,
Chuck