13 Sep
2011
13 Sep
'11
1:11 p.m.
I find that one needs to be very careful when prising,
it is all too
easy to rip out the through-hole plating. It may not be a disaster but
sometimes it is very hard to solder the new IC on the component side.
Or uyou'll damage the connection to a trace on an internal layer and not
know where it goes. Or you'll amke an intermittant fault.
Yes, you do have to be caful -- very careful -- if you try to prise the
IC out, but with experience you get to know how much force you can safely
apply. And not go beyond it.
-tony