4 Aug
2004
4 Aug
'04
9:39 p.m.
Marvin Johnston wrote:
jpero(a)sympatico.ca wrote:
I work for a rather large semi mfg. and out tech moves a lot BGA
paxkages on and off out test systems.
I would hazzard a guess, observing the problems we have had with 900+
bunp BGA packages that it
would be nearly impossible to replace a BGA with equipment available to
this group.
But OTHO, this group can be rather creative.
Some of the problems seen are package creep from un-cured packages, and
bad allignment, even with
computer controlled, robotic, microscopic placement soldering machines.
Jim Davis.
I would kill to own the gear in the HW lab.
So I'm curious how you got around to to get
all the balls on the
BGA melted with that? Also not blowing the BGA off like leaf in a
wind?
Another way to reflow SM boards is to use an iron set high enough to
melt the solder and get it to flow. While I've never worked with BGAs, I
am curious if the iron would do the same thing and get things hot enough
to just lift the BGAs off?