Scott Quinn wrote:
Yup, get ready
to solder .2 mm balls on 800 balls BGA.
Get your toaster-oven ready ;-)
The really annoying thing about BGA is that I haven't figured a way to
desolder and reuse chips. Very vexing.
Surface mount is good food...except BGA. What a huge pain in the
butt. I understand the need for that sort of density, but PCB routing
for BGA is a big pain, and as you stated, dealing with the chips
physically really sucks.
I've done *all* types of surface mount stuff in my home lab...except
for BGA. The big show-stopper is the lack of means to inspect the
soldering job. Eventually I hope to obtain a small X-ray machine (of
the type used for bridge inspection, etc) to be able to check out the
soldered balls.
(soldered balls...ow!)
-Dave
--
Dave McGuire
Cape Coral, FL