3 Dec
1999
3 Dec
'99
3:03 p.m.
At 12:59 AM 12/4/99 +0000, Tony wrote:
Yes, sure you do.
But the point is you can heat the pins of a PQFP (or whatever) _one at a
time_ and melt some of this alloy into the solder, thus making the
solder-alloy mix melt at a much lower temperature. Then, after you've
treated all the pins you can warm the device with a hot air gun or
similar which will melt the 'solder' on all the pins which will then flip
off the board.
Hmmm. Well I guess that's one way of doing it. But I take stuff like
this off by heating the pins one at time and slipping a piece of very thin
metal under them so that they don't restick to the circuit board. I take
off 20 something pin surface mount devices this way in a matter of minutes.
It doesn't mess up the board or part (I reuse both).
Joe
Perhaps it was this list, but I have just read about
solder removal alloy.
Its a solder looking stuff used to remove complex multipin chips. You melt
it onto the existing solder and it forms an alloy with a VERY low melting
point so the chip can be removed with much less heat, ie wave a heat gun
and it drops off.
That's an interesting idea. But I certain that you'd have to heat the
joint to the melting pont of the old solder before this stuff would alloy