On 12/10/2014 05:10 PM, William Donzelli wrote:
Behind
DEC's PDP-1, funky light brown paint and all, is presumably some
contemporary innovation in packaging or fab process?
Actually, the DEC system
modules used in the PDP-1 through the PDP-6
(I think?) were sort of a bad design. Expensive connectors, restricted
airflow, and towards the end they grew too large and unwieldy. The
Flip Chip was a huge improvement.
Yup, the system building blocks were single-sided
paper-phenolic
boards with a crummy aluminum frame, and these blade-type
connectors hand-wired to the board. Germanium transistors,
boards that were VERY easy to crack or damage when repairing,
and I think no provision for airflow at all.
Jon