10 Aug
2008
10 Aug
'08
2:05 p.m.
Eric Smith wrote:
Roy J. Tellason wrote:
Not definitive as to when the DIP was first introduced, but a couple of datapoints:
- 1965 TI catalog shows only flatpacks
- 1966 Fairchild catalog shows flatpacks, round cans (metal and epoxy),
and 14 and 16-pin DIP packages.
The DIP packages are also referred to as being "plug-in packages".
Quote from the 1966 Fairchild catalog:
The Dual In-Line - the most significant contribution to
micro-circuit packaging in recent years - is a Fairchild concept.
Its mechanical design incorporates the ultimate in design balance:
thermal resistance is optimum, packaging density can be maximized
without economic burden, and the cost of interconnection and attachment
typically runs 10% of the cost of similar assembly with flat packs.
The Dual In-Line package is fully hermetic, and although designed
primarily to meet the economic objective of most industrial
applications, it meets all the environmental requirements imposed
by military systems.
There were also those "flatpacks" which
I never could figure out. A precursor
to surface mount? Something else?
Yes, for military applications. For instance, the Apollo Guidance
Computer is full of chips in flatpacks.
I'm not an expert on early IC packaging, but AFAIK the flatpack predated
the DIP. Prior to the DIP, most ICs had 10 pins or fewer, and were
offered in flatpacks or round metal cans.