21 Nov
2009
21 Nov
'09
4:19 p.m.
On 11/21/09, Eric Smith <eric at brouhaha.com> wrote:
Many of the DEC bus driver/receiver/transceiver chips
were binned
(selected) for specs beyond what the manufacturer guaranteed for
standard parts. One of the characteristics they binned for was low
leakage current, which was essential on large systems.
What would it take to build a rig to "bin" modern chips?
-ethan