22 Nov
2012
22 Nov
'12
1:45 p.m.
I have a non-CC HP device that has developed issues, probably because of a combination of
the lead-free
transition and usual Chinese quality.
I'm planning on attempting a re-solder by reflowing in an oven (no hot-air rework
station yet).
It seems as though it would be best to find some way to flux the balls to ensure that the
connection is good. I'm not removing the chip, so would a solution of rosin flux
diluted in
alcohol and dripped onto the BGA work? Any better way, or is it unnecessary?
My plan was to ramp it up to 400F in an oven, soak for 5 mins, then cool down to minimize
thermal
issues. Does this sound good?