16 Jan
2017
16 Jan
'17
11:26 a.m.
On Mon, Jan 16, 2017 at 12:35 PM, Jon Elson <elson at pico-systems.com> wrote:
[...]
a pump makes it work 10X better. The trick, as described in the Pace
manuals, is you heat the connection for several
seconds, then apply vacuum
and orbit the tip so it moves the component pin in the plated through
hole. That orbiting gets ALL the solder out of the hole.
While I wholeheartedly agree with the tool advice and the trick, I lifted a
bunch of traces on a PDP8a CPU board doing this. I don't know if it was
the particular board or generally crappy manufacturing at issue here. All
the HP test equipment I've fixed, most if not all from 1985+-7, survived
worse punishment.
I've also started reflowing and adding fresh solder before attempting to
desolder. Could be better heat transfer, or just easier to suck up a
larger blob.
b