--- On Sun, 4/3/11, Steven Hirsch <snhirsch at gmail.com> wrote:
Still curious what folks' experiences are in using a
hot-air reflow tool to soften up through-lead components
from behind for removal.
Well, I don't have a hot air rework station, but I do have a heat gun (the sort used
for stripping paint...), and I have used it many times to scavenge components from circuit
boards. It's pretty easy to desolder DIP packaged chips like this. But, usually, the
board is damaged from the heat - it starts to delaminate a bit, solder mask burns, etc.
With practice though, it is possible to desolder components without damaging the board in
this manner.
When it comes to that DSUB connector, I'd probably just break/cut away as much of the
old connector as I can, and desolder the pins manually. You're less likely to damage
the board that way. You'll need a fairly hefty iron to desolder the ground
lug/mounting ears though, but the pins should pose no particular problem.
I have done some work on Lisa boards, replacing RAM chips, etc, and I had no problem with
the data/address pins on RAM chips - but the power pins were very difficult. The Lisa RAM
boards are four layer, and I think the inner two are just ground and power planes.
-Ian