21 Jul
2016
21 Jul
'16
4:56 p.m.
On Jul 21, 2016, at 7:07 PM, Liam Proven <lproven
at gmail.com> wrote:
...
PLCC and PQFP both are plastic packages with leads on all 4 sides. But PLCC specifically
means a package with J-leads: the legs come out the package side, go straight down, and
tuck under the package in a J-shaped curve. PQFP (and variations with similar acronyms)
have "gull wing" leads: out the side, down to near the board, and then outward
resting on the board.
SA110 is definitely PQFP. Here's a PLCC for comparison:
http://www.batronix.com/images/products/chips/PLCC32-500-330.jpg
PLCCs have fairly limited lead counts; they were common for 44 lead packages, and perhaps
a bit more. PQFP goes well over 100, especially in the "fine pitch" ones with
lead pitch under 1 mm. (Pain in the *** to solder...) Beyond what those can do, or for
extra small packaging, we get BGA -- ball grid array.
paul
They're all plastic pin grid array
packages. No heatsink at all. Nor does the datasheet for the PQFP show
anything related to a heatsink. It also shows a PLCC version; no heatsink
there either, and again I've never seen one. Maybe that's just because I
normally only saw them in Acorn machines, of course.
You seem to misunderstand my remark about heatsinks.
It is also possible that I am misusing the term "PQFP" but I have
attempted to confirm it with Google image searches and I think it's
what I meant.
...
Is that not a PQFP chip? A flat plastic package with pins on all 4 sides? 