10 Apr
2010
10 Apr
'10
6:15 p.m.
Well, yes and no. ?The web ?(and IEEE's
transactions on semicondutor
packaging) is littered with papers comparing eutectic Sn-Pb solder
with RoHS lead free and the results seem to be in favor of leaded
solder. ?In particular, Pb-free solder seems to exhibit some
brittleness that Pb solders do not.
This is basic metallurgy - I doubt there is much debate here. How much
the brittleness plays into the equation is where the debate is.
It's not as if we can compare 70's era IBM
BGAs with today's
material, either. ?Today's BGAs tend to be larger and dissipate more
power.
And IBM was soldering directly to the chips with no binding wires.
When done badly, as in the Xbox "Red Ring of
Death", failure results.
?When done well with careful design, RoHS BGA work is probably quite
durable.
"Done well" is key. The fact that most consumer grade electronics is
made in China today, with their "interesting" ideas of quality,
traceability, accountability, quotas, and so forth, often stands as
the unmentioned elephant in the room.
--
Will