On Thu, 23 May 2002, Jeff Hellige wrote:
I was starting
to wonder how they might have installed that QFP without a
cover. It would be possible to hand solder such a chip, instead of using
an automated hot air system, but hand soldering that size of QFP would not
be an easy task, and there would be a serious risk of flux contamination
of the die. I really haven't seen too many chips that used a clear cover,
and I'd guess they were still debugging/testing that particular chip.
I really had to turn the system slowly in the light to see that there
was something covering the whole chip. It was very difficult to spot.
The cover is probably removable, thought I'd certainly not try removing
it... The reason they'd use a removable cover is so the whole board could
be put in a stand, under a micro-manipulator, and tiny probes could be
used to probe at different spots on the chip's die.
-Toth