I didn't know we had this example in the collection, they were
hybrids like IBM SLDs
Do you know of any module part numbers that used them?
On 12/21/18 2:40 PM, William Donzelli wrote:
The
original "Flip Chip" was a packaging failure. It was literally a die bonded to a
PCB
and never went into production.
I think it is mentioned in "Computer Engineering"
IBM perfected the techniques to do this later with the development of solder bumps and
IR reflow.
Are you talking about the little black rectangles, sort of SIP
packages, DEC tried in the late 1960s? They were a disaster with
reliability, but they did ship.
--
Will