10 Mar
2011
10 Mar
'11
8:30 p.m.
On 3/10/11 8:19 PM, Mr Ian Primus wrote:
The term you're looking for is "side brazed".
Pin corrosion
sets in a few years after the disintegration if the
foam is left alone enough to stay intact.
Yes, and it's especially bad on the ceramic packages with the fragile
side-attached legs - not the ones that exit the package and then bend
90 degrees down, but the ones that are simply attached to the side of
the chip body. Don't know what they're called or how better to
describe it... But something much more annoying, that just happened
to me (and
prompted the post), was receiving a new, old stock Zilog prototyping
part (microcontroller w/ piggyback EPROM socket) that I paid too much
for, only to open the package and find it still neatly in it's
original little promotional clamshell box. Stuck in that stupid foam.
The legs are all still attached, but they're all black with
corrosion. I sincerely hope that it will still make suitable contact
with a socket. If not, I suppose I can solder it into a machine
tooled socket, but... Grumble...
Ugh!! Was it perhaps a Z8603 or Z8613?
-Dave
--
Dave McGuire
Port Charlotte, FL