19 Nov
1999
19 Nov
'99
7:08 a.m.
>> With a cooler that is chip/plate/water
don't you want to keep the "plate"
>> as thin as possible?
>Jep, since phi = lambda*S*delta-T / delta . Just,
I didn't use a
>simple plate and only one waterlayer, but rather a system of pipes
>(drilled holes) to have a) a better controll for the water flow and
>b) enlarge the plate / water contact by three. As larger the
>surface (S) as higher the possible thermal current (vulgo amount
>of transported heat). I can't enlarge the chips surface, so S is
>fixed between chip and 'plate', but I can enlarge S between 'plate'
>and water.
>The minimal thickness is defined by your tools and
skills - I used
>0.8 mm (~1/30 inch) as minimal thickness betreen one pipe and the
>chip.
Since we are talking fluid cooling, anybody putting a
heatsink on both
sides of the chip?
I would not worry too much about the water side,
pressure and flow can work
wonders there, but would keep the copper plate just thick enough to avoid
hot spots and cover as much of the chip surface as electrically possible.
Well, sounds gut at first sight - just three problems:
First you have only a _very_ small free area on the 'other' side - there
are some nasty pins, and somehor it is no-good to touch them.
Ans second, this is hard to do in any standard board - and even
with custom extenders you still have to connect them and the
wire length becomes a problem - adding 10% corespeed and loosing
20% bus speed isn't exactly a gain.
Gruss
H.
--
Stimm gegen SPAM: http://www.politik-digital.de/spam/de/
Vote against SPAM: http://www.politik-digital.de/spam/en/
Votez contre le SPAM: http://www.politik-digital.de/spam/fr/
Ich denke, also bin ich, also gut
HRK