Ethan Dicks wrote:
I _have_ thought about that for replacement -8/L and
-8/i boards -
design a simple board with, say, 4 to 6 16-pin SO pads and decoupling
caps and a dual row of jumper pads to cross-connect the edge fingers
to the various chip pads to be able to replicate, say, an M111 vs an
M117. The "problem" is that I doubt you could get real TTL (not
LS-TTL) parts in SO. I haven't experimented with replacing TTL with
LS parts in any of my -8s, so I don't know if there would be any
issues or not. So far, I've always had enough of the right things on
hand when I go to replace a chip on an M-series module. I would think
that the dimensions could be on the order of 2 x the size of just the
area of the fingers.
The advantage, of course, is that it would be easy to make a large
number of these on one PCB panel, reducing per-unit costs. Using one
(or maybe two at most) base designs would also help quantity issues.
You could sit down one day and make a stack of a dozen M111s, then
make two dozen M113s the next day with the same PCB; just add the
right SO-parts and configure the jumpers in the right order, and there
you are.
A variation on this theme might be to build a very small number of
different types of boards, but with a CPLD on each one...a small, cheap
one like a Xilinx XC9536 (something like $3/ea qty. 1)...then have a
JTAG connector on each board, and squirt the "personality" into the
board that way. I've not had a chance to work closely with
FlipChip-based machines (unfortunately) so I don't know how much
consistency there is on things like power pins and such, so I don't know
if this'd be practical, but I think it's an interesting idea.
-Dave
--
Dave McGuire
Cape Coral, FL