4 Sep
2001
4 Sep
'01
6:44 a.m.
On Tue, 4 Sep 2001, Carlos Murillo wrote:
HP needed better production technology than what they
had in
order for their new chip design to stick. The choices were DEC,
Intel and IBM. Guess what happened.
IBM is doing the multi-layer ceramic interconnect packaging for the
Itanium.
Peace... Sridhar