14 Aug
2006
14 Aug
'06
4:11 p.m.
From: "Ethan Dicks" <ethan.dicks at gmail.com>
That'd probably work pretty well. One could also bias things so that the
parts one was sure of went into the etch, and anything that looked one
wasn't sure they got right could go in the wrap.
Vince
On 8/14/06, vrs <vrs at msn.com> wrote:
> So the backplane (which also wants to be physically large) ends up being
a
> really expensive (and nearly impossible to fix)
PCB. Might be better to
use
> wire-wrap (or maybe space the connectors way
apart and try for 2 layers)
for
the prototype
:-).
How about what DEC did for later backplanes... 2-layer board plus
wire-wrap? You could do the easy stuff, power connections, etc., in
copper, then do some of the congestion relieving stuff in the
wire-wrap layer. That many wire-wrap sockets (of whatever style)
wouldn't be cheap, so I doubt it would save much money over a 4-layer
backplane, but you'd make part of the backplane circuit accessible.