18 Nov
2004
18 Nov
'04
3:02 p.m.
On Fri, 19 Nov 2004 00:25:01 +0000 (GMT),Tony Duel wrote:
However, I would always claim a schematic can be
produced (direct
chip-on-board being a possible exception!).
The other 'newer' exception would be ball-grid-array packaged parts.
Fortunately, the most interesting things to reverse-engineer are still
mostly through-hole with conventional DIP packaging, etc.